GD900 Thermal Paste – High Conductivity CPU & 3D Printer Heatsink Compound

GD900 is a high-performance thermal paste designed for CPUs, heatsinks, and 3D printer stepper motor cooling. Excellent thermal conductivity ensures efficient heat transfer and stable temperatures.

• Thermal conductivity: 4.8 W/m·K
• Available in 1g, 3g, 7g, 15g, and 30g sizes
• Operating temperature: -50°C to +200°C
• RoHS and REACH compliant – non-toxic
• Non-corrosive, low oil separation
• Compatible with all CPUs, GPUs, and heatsinks